- CAD/CAE Design & Analysis: Support the mechanical design and engineering analysis of semiconductor CMP equipment using AutoCAD (2D) and SolidWorks (3D).
- Simulation & Structural Optimization: Apply FEA (Finite Element Analysis) and CFD (Computational Fluid Dynamics) to evaluate component performance, validate localized modules, and optimize mechanical structures.
- Experimental Testing & Data Analysis: Assist with equipment testing, organize and analyze experimental data, and prepare technical documentation to support design verification and improvement.
- Manufacturing Integration: Support the preparation and management of engineering drawings, Bill of Materials (BOM), and other technical documents required for manufacturing and equipment integration.
- EFEM & Wafer Transfer Systems: Assist with precision calibration and testing of EFEM Robot wafer transfer modules to ensure accurate wafer handling and seamless synchronization with semiconductor equipment.
- Cross-functional Collaboration: Work with mechanical, process, manufacturing, and other engineering teams to support equipment development, troubleshooting, and continuous improvement.