Mentor

Jamie WU

PERSONAL BIO WORK EXPERIENCE AND AWARDS EDUCATIONAL BACKGROUND INSTRUCTION LANGUAGES Job Positions

吳晏城 Jamie WU

JOB TITLE

Associate Vice President of Investor Relations

DEPARTMENT

C SUN/General Manager’s Office

INSTRUCTION LANGUAGES

Mandarin
English

C SUN

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PERSONAL BIO

Jamie Wu is Director of Project Management in the General Manager’s Office at C SUN Manufacturing, with more than 30 years of experience in the technology equipment industry, spanning machine tools, flat-panel display equipment, and semiconductor equipment. Since joining C SUN in 2000, he has held roles across manufacturing, R&D, technology, operations, marketing, investor relations, and corporate communications. His international experience in Germany and Japan has also shaped his expertise in technology localization, engineering management, and cross-cultural collaboration.

His current interests include semiconductor advanced packaging, AI-enabled engineering, Engineering Digital Twin, OpenUSD, physics-based simulation, and smart manufacturing, with a focus on translating emerging technologies into practical engineering solutions and sustainable business value. He has also contributed to industry-academia collaboration and engineering talent development through teaching and curriculum advisory roles at Feng Chia University. In 2026, he received the Outstanding Spokesperson Award in the private-sector category from the Public Relations Foundation, reflecting his commitment to connecting technology, business, and effective communication.

WORK EXPERIENCE AND AWARDS

【Work Experience】

C SUN MFG. LTD., Taiwan
- Associate Vice President, Investor Relations; Corporate Spokesperson; Advanced R&D Technologies (2023-Present)
- FPD R&D Division Associate Vice President, Operations Division (2018-2023)
- FPD R&D Division Director, Operations Division (2013-2018)
- FPD R&D Department Manager, R&D Technology Division (2009-2013)
- FPD Project Department Manager, Manufacturing Division (2006-2008)
- FPD Manufacturing Section Manager, Manufacturing Division (2003-2006)
- FPD Manufacturing Engineer, Manufacturing Division (2000-2003)
Feng Chia University, Taiwan
- External Curriculum Committee Member, In-Service Master’s Program in Intelligent Manufacturing and Engineering Management, College of Engineering and Science (2024-2025)
- Adjunct Assistant Professor-level Professional Technical Faculty, Department of Mechanical and Computer-Aided Engineering (2023-2024)

【Achievement】

Outstanding Private-Sector Spokesperson Award, 2026

EDUCATIONAL BACKGROUND

Master in Industrial Engineering and Systems Management, Feng Chia University

Job Positions

Brief Introduction of the Department

【Omniverse Project Team】

The Omniverse Project Team focuses on the digitalization of semiconductor equipment and the integration of AI with virtual–physical engineering. The team develops a Digital Twin technology platform that supports the equipment lifecycle from design and validation to deployment and operation. By transforming physical equipment into intelligent digital models, the team integrates 3D CAD, OpenUSD, NVIDIA Omniverse, equipment data, and AI technologies to create a virtual engineering environment. This enables more efficient equipment development, simulation, validation, and optimization while establishing new approaches to intelligent engineering and smart manufacturing.

Department Staff Number

- Less than 5 people

Internship Job Description

Support CAD/BOM data organization and equipment hierarchy structuring.
Develop and standardize digital assets using OpenUSD.
Assist with NVIDIA Omniverse scene development and equipment visualization.
Support equipment mechanism, motion, and virtual-to-physical mapping.
Integrate equipment components, sensors, and control information with digital models.
Explore the application of AI and physics-based technologies, including NVIDIA PhysicsNeMo, PINNs, and AI surrogate models.

Preferred Intern Education Level

- Undergraduate students (third year and above)
- Master students

Preferred Intern Skill Sets or Qualities

Demonstrate proactive learning and a strong interest in emerging technologies.
Possess logical thinking and strong problem-solving abilities.
Ability to integrate knowledge across engineering and digital technology disciplines.
Strong teamwork and cross-functional collaboration skills.
Familiarity with CAD and digital modeling tools.
Basic programming skills, particularly in Python.
Knowledge of equipment and mechanical systems is preferred.

Others

- Expected working hours per week: 30+
- Salary/Financial Support: NT$250 per hour

- Additional Benefits: TBC

Students may be offered the opportunity to continue as interns for up to one additional year after completing the NTU International Mentorship Program, at the discretion of the host organization.

Brief Introduction of the Department

【Department of Foresight and Innovation Policies】

The Department of Foresight and Innovation Policies focuses on identifying emerging technologies, anticipating industry trends, and translating technological opportunities into strategic innovation initiatives. The department explores next-generation semiconductor equipment and advanced manufacturing technologies, including Pressure Anneal, Pre-Anneal 2.0, Wafer-on-Wafer (WoW) Alignment Modules, and laboratory projects. Through technology foresight, cross-disciplinary research, and collaboration with R&D and engineering teams, the department evaluates new technology directions and potential industrial applications. Its work connects long-term technology development with practical business needs, strengthens innovation capabilities, and supports sustainable technological competitiveness in the rapidly evolving semiconductor and advanced manufacturing industries.

Department Staff Number

- 5-10 people

Internship Job Description

Support the mechanical design and development of advanced semiconductor equipment.
Assist with 3D/2D CAD drawings, mechanical system design, and component selection.
Participate in equipment assembly, testing, validation, and design optimization.
Support electrical and control system development for advanced semiconductor equipment.
Assist with PLC programming, electrical component integration, and control software development.
Support functional testing, troubleshooting, and equipment automation integration.
Collaborate with cross-functional engineering teams to improve equipment performance and reliability.

Preferred Intern Education Level

- Undergraduate students (third year and above)
- Master students

Preferred Intern Skill Sets or Qualities

Demonstrate proactive learning, logical thinking, and strong problem-solving skills.
Possess hands-on ability and an interest in practical engineering applications.
Show willingness to learn across disciplines and collaborate effectively in a team environment.
Have a strong interest in semiconductor equipment and advanced technology development.
Academic background in Mechanical Engineering, Electrical Engineering, Electronics, Automation, or related fields.
Basic knowledge of mechanical design, electrical systems, or control systems is preferred.
Experience with CAD, PLC, programming, or equipment automation is a plus.

Others

- Expected working hours per week: 30+
- Salary/Financial Support: NT$ 250 per hour

- Additional Benefits: TBC

Students may be offered the opportunity to continue as interns for up to one additional year after completing the NTU International Mentorship Program, at the discretion of the host organization.

Brief Introduction of the Department

【Semiconductor R&D Division】

The Semiconductor R&D Division is dedicated to developing advanced equipment for semiconductor packaging technologies, with expertise in key processes such as bonding, lamination, and de-taping. The division integrates precision control, thermal analysis, and mechanical engineering to develop high-performance process equipment and collaborate with global semiconductor customers on next-generation packaging solutions.

Department Staff Number

- More than 10 people

Internship Job Description

Support laboratory testing and maintain test equipment to ensure reliable operation.
Conduct bonding and film lamination process testing and assist with test data analysis and reporting.
Prepare and revise 2D and 3D engineering drawings for equipment and process development.
Assist engineers with laboratory experiments, equipment validation, and technical documentation.

Preferred Intern Education Level

- Undergraduate students (third year and above)
- Master students

Preferred Intern Skill Sets or Qualities

Strong foundation in precision mechanical design, thermal-fluid analysis, motion control, or mechanics of materials.
Hands-on problem-solving skills with the ability to translate 3D CAD designs into physical equipment.
Willingness to participate in equipment assembly, testing, on-site troubleshooting, and design optimization.
Strong systems thinking and cross-disciplinary communication skills.
Ability to adapt to non-standard requirements and contribute to customized equipment development.

Others

- Expected working hours per week: 30+
- Salary/Financial Support: NT$250 per hour

- Additional Benefits: TBC

Students may be offered the opportunity to continue as interns for up to one additional year after completing the NTU International Mentorship Program, at the discretion of the host organization.

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